Study, Evaluate, Measure, and Calculate the Thermal Cracking of Rocks.

Abstract

Changes of longitudinal-wave velocity (VL), porosity, and Q, together with optical and scanning electron microscopic observations, demonstrate unequivocally that appreciable thermal cracking occurs during slow thermal cycling of Sioux Quartzite. Thermally-induced cracks develop primarily along grain boundaries and secondarily as intragranular cracks. Intragranular cracks are preferentially oriented and appear to be influenced by the preheating residual strain state locked-in the rock. Acoustic emission reveals that thermal cracking occurs only upon exceeding a threshold temperature, which for the Sioux Quartzite ranges between 200 C and 250 C. Thermal cracking increases progressively with increasing temperature, with the largest fraction of cracking occurring prior to the alpha-beta transition of quartz (573 C). In the temperature interval 200-573 C, VL decreased 40% and porosity increases 130%; new porosity is associated with low aspect-ratio cracks. Fracture intensifies during the alpha-beta transition as reflected by an abrupt decrease in Vl, a rapid porosity increase and intense acoustic emission. Above 573 C, thermal cracking continues but at a reduced rate. Porosity continues to increase but is associated primarily with high aspect-ratio cracks. Cooling induces little additional structural damage.

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Document Details

Document Type
Technical Report
Publication Date
May 01, 1977
Accession Number
ADA044238

Entities

People

  • C. Branning Johnson
  • John Handin
  • Melvin Friedman

Organizations

  • Texas A&M University

Tags

Communities of Interest

  • Air Platforms
  • Sensors

DTIC Thesaurus Topics

  • Acoustic Emissions
  • Air Force
  • Aspect Ratio
  • Calorific Value
  • Ceramic Materials
  • Climate Change
  • Crystal Structure
  • Detectors
  • Frequency
  • Grain Size
  • Laser Diodes
  • Mechanics
  • Physical Properties
  • Silica Glass
  • Temperature Gradients
  • Tensile Strength
  • Thermal Expansion

Readers

  • Materials Science and Engineering.
  • Structural Health Monitoring of Composite Structures.
  • Thermal Physics or Thermal Science.

Technology Areas

  • Microelectronics