Design Guidelines for Hybrid Microcircuits. Volume I. Beam Lead Study.

Abstract

This report is a study of the bonding of beam-leaded chips onto several types of hybrid substrates, mostly with thick film metallization. Beam lead semiconductors of various sizes were bonded on monolayer substrates as well as multilayer substrates of increasing complexity. The integrity of the bonding on the various types of substrates changes and permits the author to draw design rules for hybrid circuits comprising beam-leaded chips. Report describes a non-destructive method to test the bonds of beam-leaded chips. (Author)

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Document Details

Document Type
Technical Report
Publication Date
May 01, 1977
Accession Number
ADA044540

Entities

People

  • J. F. Linder

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Air Force
  • Beam Leads
  • Electronics
  • Electronics Industry
  • Electronics Laboratories
  • Engineering
  • Films
  • Hybrid Circuits
  • Materials
  • Microcircuits
  • Microelectronics
  • Military Research
  • Monomolecular Films
  • Semiconductors
  • Substrates
  • Thick Films
  • Thin Films

Readers

  • Allergy and Immunology.
  • Semiconductor Device Technology
  • Software Engineering

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene