Basic Adhesion Mechanisms in Thick and Thin Films.
Abstract
This report is the second quarterly report of the fourth in a series of one-year contracts at RCA to study adhesion mechanisms in thick-film conductors. During this quarter, the sintering kinetics of a specially precipitated gold powder were examined as a function of compaction force, sintering temperature, and time, as well as glass content. It was found that ultimate gold powder densification was inversely related to powder compaction force. The previously observed retrograde sintering was judged to be due to entrapped air originally present in the compacts before sintering. Conversely, gold powder densification was found to be directly proportional to glass content. This test confirmed that liquid-phase-assisted sintering is operating in at least the first stage of sintering. With regard to mixed-bonded and reactively bonded conductors, a recent investigation of reaction Kinetics and products was critically reviewed. This review served to update and refine the nature and extent of experiments that need to be performed in this area. Proposed experiments include the elucidation of the formation of reaction products and the relationship of these products to both substrate and metal phases. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Jul 01, 1977
- Accession Number
- ADA044682
Entities
People
- Kenneth R. Bube
- Thomas T. Hitch
Organizations
- RCA Corporation