The Effects of Substrate Composition on Thick Film Circuit Reliability.
Abstract
The initial stage sintering kinetics for lead borosilicate glasses were studied in order to determine the effects of composition on the surface tension to viscosity ratio. Impurities in the raw materials were shown to have no effect on this ratio, but changes of a few percent in the major constituents resulted in significant changes in both the magnitude and the temperature dependence of this ratio. Thick film resistors were fabricated with and without substrate dissolved in the resistor glass, and significant differences were found in both the magnitude and the temperature dependence of the sheet resistance. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Aug 31, 1977
- Accession Number
- ADA045085
Entities
People
- R. W. Vest
Organizations
- Purdue University