Basic Adhesion Mechanisms in Thick and Thin Films.
Abstract
In this third year of the study, multicomponent systems (consisting of gold plus one or two platinum group metals) were examined in both model and commercial ink form, in order to understand the parameters which affect film adhesion and solderability. Solderable Au-Pt and Au-Pt-Pd metallizations are the second most widely used films in military hybrid circuits. Therefore, the factors which broadly influence metallization solderability, adhesion strength, and aged film adhesion strength, in the presence and absence of solders, were examined in some detail. Of 21 commercially available Au-Pt and Au-Pt-Pd films initially analyzed for composition, and adhesion strength (aged and unaged), five of these and a related ink were selected for more detailed study. Adhesion strength of the six inks was evaluated as a function of three print thicknesses, four peak firing temperatures, and two cooling rates from peak firing temperature. Data are presented for the inks fired on both 96 and 99.5 wt pct alumina substrates. Values for adhesion strength were also determined after aging, both with and without 62Sn-36Pb-2Ag solder present. With one exception, the adhesion strength of the inks was generally sensitive to peak firing tempeature and less sensitive to thickness. Cooling rate changes did not affect solderability significantly in any of the six film materials.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jan 01, 1977
- Accession Number
- ADA045831
Entities
People
- Kenneth R. Bube
- Thomas T. Hitch
Organizations
- RCA Corporation