Development of Improved Solders for Electronic Reliability.

Abstract

A higher temperature solder alloy intended for use on polyimide printed wiring boards was developed. The solder shows no evidence of cracking after exposure to 500 temperature cycles between 200 C and -55 C. A comparative test with Sn63 between 125 C and -55 C resulted in cracking after 200 cycles. The alloy (90Pb9Cd1Zn) was the result of selecting, testng and modifying all possible alloy systems that would be suitable for printed wiring board application. The resulting alloy, in addition to providing increased reliability, offers a significant cost reduction over the conventional tin-lead system.

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Document Details

Document Type
Technical Report
Publication Date
Jun 01, 1977
Accession Number
ADA046213

Entities

People

  • M. C. Denlinger
  • R. W. Korb
  • V. F. Lardenoit

Organizations

  • Hughes Aircraft Company

Tags

Communities of Interest

  • Biomedical

DTIC Thesaurus Topics

  • Alloys
  • Chemical Analysis
  • Chemical Reactions
  • Chemical Synthesis
  • Chemistry
  • Circuit Boards
  • Failure Mode And Effect Analysis
  • Fatigue Tests (Mechanics)
  • High Temperature
  • Manufacturing
  • Materials
  • Materials Laboratories
  • Metallic Compounds
  • Phase Diagrams
  • Solid Solutions
  • Test And Evaluation
  • Test Methods

Fields of Study

  • Materials science

Readers

  • Integrated Circuit Design and Technology.
  • Materials Science and Engineering.
  • Software Engineering

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems