US Army Panama Field Test of Plastic Encapsulated Devices,
Abstract
Field testing of hermetic and plastic encapsulated semiconductors has shown that ceramic dual-in-line packages (DIP) are superior than most plastic packages. Hermetic flat packs, however, are poorer than most plastic packages and a device fabricated with a trimetal interconnection metallization and an epoxy novolac encapsulant can be as good as ceramic DIPs. Silicone encapsulated devices are usually the poorest performers. Devices tested in the storage condition have, in some cases, poorer results than their equivalent, which have been biased. This can be attributed to reduction of the relative humidity at the chip surface due to a higher temperature produced by the power dissipation of the device. In general, in this field test program, plastic devices have not performed as poorly as had been expected. Newer devices, which include CMOS circuits and integrated circuits fabricated with various tape-chip carrier processes, are beginning evaluation. Results from tests on these units will be a good yard stick in assessing the reliability of semiconductors in the future.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jul 01, 1977
- Accession Number
- ADA048413
Entities
People
- Edward B. Hakim
Organizations
- United States Army Communications-Electronics Command