Basic Adhesion Mechanisms in Thick and Thin Films.

Abstract

In the study of frit-bonded materials this quarter, the sintering of gold powders was studied and indicated to be assisted by the presence of a lead borosilicate glass in the second stage of sintering (solution-precipitation) at higher temperatures. The evolution of organic-vehicle-burnoff gas products from sintering gold and gold/glass powders was also investigated. For the materials studied, which were typical of thick-film paste constituents, it was concluded that organic burnout should not interfere with the sintering of most gold powders. It was further determined that at the completion of burnout, the organic burnoff gases should be able to escape through the glass phase rapidly enough to prevent their entrapment in the partially sintered structure.

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Document Details

Document Type
Technical Report
Publication Date
Nov 01, 1977
Accession Number
ADA048618

Entities

People

  • Kenneth R. Bube
  • Thomas T. Hitch

Organizations

  • RCA Corporation

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Adhesion
  • Body Weight
  • Bonding
  • Burning Rate
  • Contracts
  • Electronics
  • Energy
  • Films
  • Heat Of Activation
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Oxide Films
  • Sintering
  • Substrates
  • Thick Films
  • Thin Films

Fields of Study

  • Materials science

Readers

  • Powder metallurgy of Titanium alloys.
  • Thin Film Deposition Science.