The Effects of Substrate Composition on Thick Film Circuit Reliability.

Abstract

The initial stage sintering kinetics for lead borosilicate glasses were studied in order to determine the effect of substrate dissolution in the glass on the surface tension to viscosity ratio. Substrate additions up to 10 weight percent decreased the magnitude of this ratio by a factor of 10 but left its temperature dependence unchanged. Thick film resistors were fabricated with and without substrate dissolved in the resistor glass, and differences up to a factor of 100 were found in both the magnitude and temperature dependence of the sheet resistance. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Nov 30, 1977
Accession Number
ADA048890

Entities

People

  • R. W. Vest

Organizations

  • Purdue Research Foundation

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Bricks
  • Electrical Properties
  • Engineering
  • Film Resistors
  • Films
  • Glass Resistors
  • Low Temperature
  • Materials
  • Materials Engineering
  • Measurement
  • Partial Pressure
  • Physical Properties
  • Resistance
  • Resistors
  • Surface Tension
  • Thick Films
  • Water Vapor

Readers

  • Electromagnetic Wave Scattering and Antenna Radiation Engineering
  • Software Engineering
  • Surface Engineering/Surface Coating Technology.