High-Reliability, Low-Cost Integrated Circuits.

Abstract

Wafer fabrication is nearly completed. COS/MOS circuits have been successfully fabricated utilizing sputter etch technology for platinum definition. Trimetallization technology with silicon nitride overcoat passivation, copper beam-tape automated assembly, and silicone molding compound has proven to be the best system for fabrication of high reliability low cost integrated circuits. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Nov 03, 1977
Accession Number
ADA049763

Tags

Communities of Interest

  • Advanced Electronics
  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Air Force
  • Air Force Facilities
  • Assembly
  • Ceramic Materials
  • Electronics
  • Electronics Laboratories
  • Fabrication
  • High Reliability
  • Integrated Circuits
  • Life Tests
  • Platinum
  • Production
  • Quality Control
  • Reliability
  • Semiconductors
  • Stress Tests
  • Test And Evaluation

Readers

  • Software Engineering
  • Thin Film Deposition Science.