Pitting in Aluminum.
Abstract
Observations by electron microscopy of transient pitting during film growth in the passive state were extended to a lower potential. Electrochemical studies in sulfuric acid of the effect on cathode behavior of copper contents from 0.1 to 600 ppm showed that cathode polarization decreases with time, that corrosion potential rises with time and that the effect is accelerated by chloride additions and can be substantial even at 1 ppm Cu. It is proposed that the formation of cathodes of copper during corrosion occurs in transient pits. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Aug 19, 1977
- Accession Number
- ADA049854
Entities
People
- M. Metzger
Organizations
- University of Illinois Urbana–Champaign