Investigation of Factors Involved in Reliability Assurance of Plastic-Encapsulated Integrated Circuits.

Abstract

Upper temperature limits to accelerated stress testing of plastic-encapsulated integrated circuits were determined and evidence of chip-encapsulant interaction was obtained. Possible yield-reliability correlations were considered and alternatives to MIL-M-38510 screening were discussed for plastic-encapsulated IC's. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Feb 08, 1978
Accession Number
ADA050875

Entities

People

  • John L. Prince Iii

Organizations

  • Clemson University

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Assembly
  • Electrical Engineering
  • Electron Microscopes
  • Fabrication
  • Failure Mode And Effect Analysis
  • Heat Of Activation
  • High Temperature
  • Integrated Circuits
  • Manufacturing
  • Materials
  • Scanning Electron Microscopes
  • Semiconductor Manufacturing
  • Semiconductors
  • Standards
  • Test And Evaluation
  • Test Equipment
  • Visual Inspection

Fields of Study

  • Engineering

Readers

  • Integrated Circuit Design and Technology.
  • Mechanical Engineering/Mechanics of Materials.