I/J Band Low-Cost Crossed-Field Amplifier.

Abstract

The effort in this program is directed toward the development of an I/J band linear format injected-beam crossed-field amplifier (IBCFA) for electronic warfare, capable of power output of 1000 W peak, 200 W average, between 8.5 and 17 GHz with 20 dB gain. A laser-cut shaped-substrate meander line will be used. Performance in an E/F band IBCFA will be evaluated, for which the objective performance is 3.0 kW peak power output, 1.0 kW average power output in the 2-4 GHz band, also with 20 dB gain. In addition, a gun for I/J band is to be designed and evaluated. The most important part of this program is the development of technology of the combination of meander line, shaped substrate, and coexpansive ground plane. The shaped substrate concept, including the laser cutting approach, was originated by U. S. Army ERADCOM personnel. The substrate for the meander line is in a ladder configuration. The electrical properties of the ladder substrate with a meander line have been found to be little different from the meander substrate configuration. The substrate material is beryllia ceramic, which is necessary for good thermal conductivity. Laser cutting the substrates for both E/F band and I/J band has met with limited success to date. The breakage rate is still high, especially for I/J band dimensions.

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Document Details

Document Type
Technical Report
Publication Date
Feb 28, 1978
Accession Number
ADA051326

Entities

People

  • Robert R. Moats

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms
  • Energy and Power Technologies
  • Human Systems
  • Weapons Technologies

DTIC Thesaurus Topics

  • Air Force
  • Amplifiers
  • Composite Materials
  • Current Density
  • Electrical Properties
  • Electron Tubes
  • F Band
  • Frequency
  • J Band
  • Laser Cutting
  • Materials
  • Measurement
  • Microwave Tubes
  • Peak Power
  • Tensile Strength
  • Thermal Expansion
  • Transmission Lines

Readers

  • Electronics Engineering
  • Microwave Engineering.

Technology Areas

  • Directed Energy
  • Directed Energy - Pulsed-Laser Deposition
  • Microelectronics