QA Procedures for Complex Microcircuits.

Abstract

The purpose of this study was to establish an alternate procedure in lieu of High Magnification preseal visual for complex microcircuits. In-line wafer process controls were developed which provide effective control of the wafer visual conditions. Changes to MIL-STD-883 have been recommended to implement this process control. The study approach was to: perform wafer mapping of visual defect locations; develop in-line wafer process controls from this data; perform preliminary testing with known visual defects on LSI chips to verify alternate test methods; and perform final verification testing on complex LSI wafer product processed in accordance with the recommended procedures. In addition, it was found that a package problem generated numerous bond failures which were not adequately detected by 10 temperature cycles. A change has been recommended to MIL-STD-883 to perform 100 cycles of temperature cycling. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Dec 01, 1977
Accession Number
ADA052418

Entities

People

  • John L. Wolcott
  • Louis R. Paradiso

Organizations

  • Harris Corporation

Tags

DTIC Thesaurus Topics

  • Acceptability
  • Electrical Measurement
  • Fabrication
  • Failure Analysis
  • Failure Mode And Effect Analysis
  • Life Tests
  • Manufacturing
  • Materials
  • Measurement
  • Plastic Explosives
  • Semiconductors
  • Standards
  • Test And Evaluation
  • Test Equipment
  • Test Methods
  • Verification Tests
  • Visual Inspection

Readers

  • Software Engineering
  • Structural Health Monitoring of Composite Structures.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems