Thermal Characteristics of Hybrid Circuits.

Abstract

This report presents an evaluation of thermal resistance in hybrid microelectronics. Four different package types were used with an without multiple layer thick circuitry. Chip components were attached using both epoxy and eutectic methods. (Author)

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Document Details

Document Type
Technical Report
Publication Date
May 12, 1977
Accession Number
ADA053009

Entities

People

  • Charles E. Riley
  • Joseph Agosta
  • Richard Ribbe
  • Stephie G. Das
  • Victor W. Ruwe

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Air Force
  • Air Force Facilities
  • Assembly
  • Control Systems
  • Electronics Industry
  • Hybrid Circuits
  • Impedance
  • Materials
  • New York
  • Plastic Explosives
  • Resistance
  • Semiconductor Devices
  • Semiconductor Junctions
  • Semiconductors
  • Test And Evaluation
  • Thermal Resistance
  • Zener Diodes

Readers

  • Software Engineering
  • Thermal Physics or Thermal Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene