Thick-Film Fine Line Printing.

Abstract

This report discusses the significant parameters in fine line printing (less than 0.005 lines and spaces) of thick-film microelectronic circuits. This considerations of the materials, substrate, paste rheology and the interaction of the elements in the manufacturing process are reported. The documented results of the experimental work are presented demonstrating 3-mil lines and spaces. The yield is presented as a function of line spacing, width, and length. The conclusions include process parameters to duplicate the results. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Sep 01, 1977
Accession Number
ADA053010

Entities

People

  • Kenneth Dean
  • Robert E. Sulouff
  • Victor W. Ruwe

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Air Force
  • Air Force Facilities
  • Dielectric Properties
  • Dielectrics
  • Engineering
  • Fabrication
  • Films
  • Finishes
  • Geometry
  • High Density
  • Manufacturing
  • Materials
  • Materials Science
  • New York
  • Printing
  • Surface Roughness
  • Thick Films

Readers

  • Electrical Engineering
  • Manufacturing Engineering.
  • Systems Analysis and Design

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene
  • Space