Manufacturing Methods and Technology Engineering for Tape Chip Carrier.

Abstract

This report describes the work performed during the second quarter of a 26 month contract. The contract is aimed at establishing and demonstrating the feasibility of an automated assembly line for hybrid microcircuits using tape chip carrier technology for semiconductor devices whenever practical. The automated line will also make use of automatic substrate handling equipment to move partially assembled devices in and out of magazines. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Feb 01, 1978
Accession Number
ADA053088

Entities

People

  • Stanton R. Jones
  • William R. Rodrigues De Miranda

Organizations

  • Honeywell International, Inc.

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Air Force Facilities
  • Assembly
  • Assembly Lines
  • Circuits
  • Crystal Oscillators
  • Electronic Commutators
  • Electronics
  • Engineering
  • Manufacturing
  • Materials
  • Microcircuits
  • Resistance
  • Semiconductor Devices
  • Semiconductors
  • Test And Evaluation
  • Test Equipment
  • Test Fixtures

Fields of Study

  • Engineering

Readers

  • Integrated Circuit Design and Technology.
  • Technical Research and Report Writing.

Technology Areas

  • Microelectronics