Component Damage from Electromagnetic Pulse (EMP) Induced Transients.

Abstract

The Lance Vulnerability and Hardening Test Program was supported by a number of in-laboratory experiments on various component types. Of prime concern was the establishment of component EMP thresholds to be used in establishing the vulnerability level of the system. Reported are pulsed transient tests on over 50 component types. Testing concentrated on sensitive semiconductor components, and about 1800 individual devices were damage tested. The tests used rectangular pulses varying in width from 5 ns to 30 micros. Numerous nonsemiconductor components also were characterized. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Oct 01, 1977
Accession Number
ADA053899

Entities

People

  • Joseph R. Miletta

Organizations

  • Harry Diamond Laboratories

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Circuit Analysis
  • Crystal Structure
  • Electronic Circuits
  • Electronics Industry
  • Electronics Laboratories
  • Failure Mode And Effect Analysis
  • Field Effect Transistors
  • Heat Energy
  • Measurement
  • Microsecond Time
  • Modules (Electronics)
  • P-N Junctions
  • Power Electronics
  • Pulsed Power
  • Semiconductor Devices
  • Semiconductor Junctions
  • Semiconductors

Fields of Study

  • Physics

Readers

  • Aerospace Test and Evaluation
  • Electrical Engineering
  • Optical Fiber Sensing and Electromagnetic Propagation.

Technology Areas

  • Microelectronics