Basic Adhesion Mechanisms in Thick and Thin Films.

Abstract

This report is the fourth and final one in a series pertaining to the identification of factors which influence thick-film metallization adhesion. Prior work was concerned with the characterization of commercial thick-film conductors, i.e., gold, silver, copper, and gold-platinum (-palladium) systems. In addition, the preceding work explored vehicles, such as firing temperature and time, which influenced the basic processes of metal sintering and interactions with the adhesive agent. As a result of prior analyses, it became clear that factors which influence adhesion would differ with adhesive agent type, e.g., frit-bonded, mixed-bonded or reactively bonded. The present study addresses this distinction and explores the factors which primarily contribute to adhesion in each class. To simplify the discussion, the experiments in this year's study have been confined to gold films.

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Document Details

Document Type
Technical Report
Publication Date
Mar 01, 1978
Accession Number
ADA054269

Entities

People

  • Kenneth R. Bube
  • Thomas T. Hitch

Organizations

  • RCA Corporation

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Aluminum Oxides
  • Body Weight
  • Chemical Compounds
  • Chemical Synthesis
  • Chemistry
  • Diffraction
  • Failure Mode And Effect Analysis
  • Materials
  • Materials Science
  • Materials Testing
  • Metal Oxides
  • Mixtures
  • Oxide Films
  • Particle Size
  • Phase Diagrams
  • Powder Metals
  • Thick Films

Readers

  • Theoretical Analysis.
  • Thin Film Deposition Science.