Thermal Cycle Testing of 7-Segment Light Emitting Diodes (LED) Displays. (Test Evaluation).

Abstract

Extended thermal cycle tests were performed on four types of LED numeric displays following observation of device failure during testing of equipment containing these displays. Two types which were epoxy encapsulated had failure rates of 1 percent and 0.17 percent per thermal cycle. No failures were observed in hermetically sealed devices or the devices that were potted in a resilient material. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 1978
Accession Number
ADA054418

Entities

People

  • M. Robert Miller

Organizations

  • United States Army Communications-Electronics Command

Tags

Communities of Interest

  • Engineered Resilient Systems

DTIC Thesaurus Topics

  • Decoding
  • Diodes
  • Electronic Equipment
  • Electronics
  • Encapsulation
  • Engineering
  • Failure Mode And Effect Analysis
  • High Altitude
  • High Reliability
  • High Temperature
  • Lead Wires
  • Least Squares Method
  • Light Emitting Diodes
  • Low Temperature
  • Military Applications
  • Reliability
  • Test And Evaluation

Readers

  • Human-Computer Interaction (HCI).
  • Integrated Circuit Design and Technology.
  • Polymer Science and Engineering.