Critique of the Centrifuge as a Stressing Device.

Abstract

The results of this study provide mathematical relationships to theoretically assess the capabilities of the centrifuge test as a stressing device for the following microelectronic components: wires and wire bonds, chip and substrate attachment, lids and bases of rectangular flat-packs. The results of the study suggest that the centrifuge is of marginal utility as a stressing device for the above mentioned components. (Author)

Open PDF

Document Details

Document Type
Technical Report
Publication Date
May 01, 1978
Accession Number
ADA054946

Entities

People

  • Charles Libove

Organizations

  • Syracuse University

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Air Force
  • Equations
  • Hydrostatic Pressure
  • Materials
  • Mechanics
  • Modulus Of Elasticity
  • Pull Tests
  • Shear Stresses
  • Shear Tests
  • Stress Analysis
  • Stress Strain Relations
  • Stresses
  • Tensile Properties
  • Tensile Strength
  • Tensile Stress
  • Test And Evaluation
  • Test Methods

Readers

  • Brain and Cognitive Science; Experimental Psychology; Cognitive Neuroscience
  • Integrated Circuit Design and Technology.
  • Theoretical Analysis.

Technology Areas

  • Microelectronics