Impact Stresses in Flat-Pack Lids and Bases.

Abstract

An analysis is made of the normal handling that a microelectronic package is likely to encounter. The stresses and deformations of the lids and bases of a rectangular flat-pack caused by the accidental dropping of the package onto a floor from a height of a few feet, are assessed theoretically. The results of the study shows that the assumed normal handling conditions constitutes a severe environment which is capable of producing stress that will buckle a metallic lid or crack a ceramic lid or base. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Apr 01, 1978
Accession Number
ADA054947

Entities

People

  • Charles Libove

Organizations

  • Syracuse University

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms
  • Energy and Power Technologies
  • Ground and Sea Platforms
  • Space

DTIC Thesaurus Topics

  • Accuracy
  • Air Force
  • Bending Moments
  • Coordinate Systems
  • Drop Tests
  • Dynamic Tests
  • Elastic Properties
  • Hydrostatic Pressure
  • Measurement
  • Mechanics
  • New York
  • Numbers
  • Orientation (Direction)
  • Pressure Vessels
  • Static Tests
  • Tensile Stress
  • Test Methods

Fields of Study

  • Engineering

Readers

  • Computer Science.
  • Explosive Engineering.
  • Reinforced Composite Materials

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems