Reproducible Adhesion Test for Soldered Thick-Film Conductors.

Abstract

The need for an adhesion test method that is more reproducible from operator to operator and from laboratory to laboratory is well known in the thick-film industry. The development of such a method was begun at RCA under earlier Naval contracts, and has been completed and tested in detail in this study. Thorough descriptions of two recommended variations of the method, the apparatus required to perform them, and the evaluations made during this study are presented.

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Jul 31, 1977
Accession Number
ADA054971

Entities

People

  • Thomas T. Hitch

Organizations

  • RCA Corporation

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies
  • Sensors

DTIC Thesaurus Topics

  • Assembly
  • Data Analysis
  • Fabrication
  • Failure Mode And Effect Analysis
  • Films
  • Geometry
  • Heaters
  • Heating
  • Manufacturing
  • Materials
  • Measurement
  • Production
  • Standards
  • Statistical Analysis
  • Test Methods
  • Thick Films
  • Thin Films

Fields of Study

  • Physics

Readers

  • Software Engineering
  • Surface Engineering/Surface Coating Technology.