Hybrid Microcircuit Failure Rate Prediction

Abstract

This report presents an updated reliability prediction model for hybrid microcircuits for inclusion in MIL-HDBK-217B, 'Reliability Prediction of Electronic Equipment'. The new model differs in several ways from the previous MIL-HDBK-217B prediction technique. Some of the changes include the addition of a density factor and an interconnection factor; changes in the package factor and quality factor; and individual assessments of the effect of temperature and environment on the elements of the hybrid microcircuits. Comparisons are presented comparing the predicted failure rates to the failure rate experienced by various hybrid microcircuits in the field. Also, the relative contributions of the terms in the model are compared to the distribution of field failure causes.

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Document Details

Document Type
Technical Report
Publication Date
Apr 01, 1978
Accession Number
ADA055756

Entities

People

  • Timothy E. Turner

Organizations

  • IIT Research Institute

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Aerospace Industry
  • Digital Circuits
  • Electronic Components
  • Electronic Equipment
  • Electronics Industry
  • Electronics Laboratories
  • Failure Analysis
  • Failure Mode And Effect Analysis
  • Film Resistors
  • Integrated Circuits
  • Materials
  • Modules (Electronics)
  • Semiconductors
  • Test And Evaluation
  • Thick Films
  • Thin Films
  • Transistors

Fields of Study

  • Engineering

Readers

  • Computational Modeling and Simulation
  • Integrated Circuit Design and Technology.

Technology Areas

  • Microelectronics