Development of Microstructure and its Relationship to the Mechanical Properties of Drawn Copper.

Abstract

Dislocation microstructures formed during drawing of copper to strains up to 7, at deformation temperature between 77 and 473K, have been investigated, together with their relationship to the resulting mechanical properties. The changes in microstructure and tensile flow stress are explained by dynamic recovery and recrystallization processes; correlations of mechanical properties are made with parameters describing the dislocation microstructure. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Nov 01, 1977
Accession Number
ADA056038

Entities

People

  • J. A. Retchford
  • R. B. Nethercott

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Boundaries
  • Cell Size
  • Cell Structure
  • Cells
  • Cellular Structures
  • Crystal Structure
  • Dislocations
  • Electron Microscopes
  • Electron Microscopy
  • Grain Boundaries
  • Grain Size
  • Materials
  • Mechanical Properties
  • Microstructure
  • Recovery
  • Stresses
  • Tensile Properties

Fields of Study

  • Materials science

Readers

  • Materials Science and Engineering.