The Effects of Substrate Composition on Thick Film Circuit Reliability.

Abstract

Thick film resistors were prepared with and without AlSiMag 614 substrate dissolved in the resistor glass. The electrical characteristics of these devices were studied during sinter/anneal cycles up to 525 C. Two effects were identified, one which results in a slow decrease in resistance with time at the lower anneal temperatures and another which results in a more rapid increase in resistance at the higher anneal temperatures. The mechanisms of these effects are discussed in terms of changes in glass composition resulting from resistor - substrate interactions. (Author)

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Document Details

Document Type
Technical Report
Publication Date
May 30, 1978
Accession Number
ADA056076

Entities

People

  • R. W. Vest

Organizations

  • Purdue Research Foundation

Tags

DTIC Thesaurus Topics

  • Curing
  • Electrical Engineering
  • Electrical Properties
  • Engineering
  • Film Resistors
  • Films
  • Glass Resistors
  • High Temperature
  • Materials
  • Materials Engineering
  • Physical Properties
  • Residual Stress
  • Resistance
  • Resistors
  • Standards
  • Temperature Coefficients
  • Thick Films

Readers

  • Thin Film Deposition Science.