Use of Computers in Mold Design,

Abstract

This paper presents efforts to determine a system to evaluate mold designs using computer simulations. Although the report describes the mold design for a thin-walled uranium hemisphere, the system is applicable to virtually any shape mold.

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Document Details

Document Type
Technical Report
Publication Date
Jun 01, 1978
Accession Number
ADA056453

Entities

People

  • Robert E. Keenan Jr.
  • William C. Erickson

Organizations

  • Los Alamos National Laboratory

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Ceramic Materials
  • Coefficients
  • Computer Programs
  • Computer Simulations
  • Computers
  • Conductivity
  • Cooling
  • Costs
  • Digital Computers
  • Graphitic Materials
  • Heat Energy
  • Heat Transfer
  • Heat Transmission
  • Metals
  • Simulations
  • Temperature Gradients
  • Thermal Conductivity

Readers

  • Computer Science.
  • Metallurgy
  • Software Engineering