Evaluation of Ceramic DIP Carrier,

Abstract

A system of mounting dual in-line packages on ceramic substrates without the use of conventional through-holes is found to be feasible. Thermal information relating to substrate performance is developed. A protective coating for copper is discovered. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Jun 30, 1978
Accession Number
ADA056653

Entities

People

  • William J. Musgrave

Organizations

  • Naval Air Warfare Center, Indianapolis

Tags

Communities of Interest

  • Air Platforms
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Acquisition
  • Air Supplies
  • Air Temperature
  • Coatings
  • Data Acquisition
  • Electronic Equipment
  • Engineering
  • Heat Sinks
  • Materials
  • Materials Laboratories
  • Power Conditioning
  • Protective Coatings
  • Resistance
  • Substrates
  • Test And Evaluation
  • Thermal Resistance
  • Thick Films

Readers

  • Software Engineering
  • Surface Engineering/Surface Coating Technology.