Photolithographic Techniques for Surface Acoustic Wave (SAW) Devices.

Abstract

The object of the program is the establishment of a production capability for surface acoustic wave devices of varied design and material for the purpose of meeting estimated military needs for a period of two years after the completion of the contract and to establish a base and plans which may be used to meet expanded requirements. The primary requirement is the pilot line production of devices that are reliable, reproducible, and low cost. This report describes the progress to date on the pilot line phase of the program. The degree of attention to detail has been adjusted upward from original planning to adequately report pricing and yield data and to ensure accuracy in the device performance evaluation. Solder sealing has recently been identified as a potential problem area in the manufacture of SAW devices and is being addressed. New solder seal methods are being developed and documented and an alternate approach of projection weld sealing is being investigated. Results of these investigations are reported.

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Document Details

Document Type
Technical Report
Publication Date
Feb 01, 1978
Accession Number
ADA056840

Entities

People

  • L. Dyal

Organizations

  • Hughes Aircraft Company

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Acoustic Waves
  • Aircrafts
  • Assembly
  • Delay Lines
  • Fabrication
  • Frequency
  • Gas Tungsten Arc Welding
  • Insertion Loss
  • Lithium Niobates
  • Manufacturing
  • Materials
  • Piezoceramics
  • Production
  • Production Engineering
  • Pulse Compression
  • Surface Acoustic Wave Devices
  • Surface Acoustic Waves

Readers

  • Integrated Circuit Design and Technology.
  • Life Cycle Cost Analysis
  • Technical Research and Report Writing.