An Analytical Model for Bonded Joint Analysis in Composite Structures Including Hygrothermal Effects.
Abstract
A plane-strain model is developed for symmetric, anisotropic laminated plates subjected to thermal, moisture, and mechanical loading including surface tractions. Provision is made to allow assessment of the relative importance of the normal strain and of various off-axis effects by the use of tracing constants. The solution for stresses and displacements is given for a single plate element, and the computations are demonstrated by numerical examples. The basic equations for a bonded joint composed of plane-strain plate adherends are derived and discussed. References to alternate derivations are given whenever appropriate in order to facilitate comparisons. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Feb 01, 1977
- Accession Number
- ADA058818
Entities
People
- Jack R. Vinson
- Robert C. Wetherhold
Organizations
- University of Delaware