The Effects of Substrate Composition on Thick Film Circuit Reliability.
Abstract
The viscosity of the resistor glass was measured as a function of dissolved AlSiMag 614 substrate from the softening point to the annealing point of the glasses. The isothermal viscosity was found to increase by a factor of 20 for glass with 10w/o dissolved substrate relative to the standard lead borosilicate glass. The sheet resistances and hot and cold TCRs of thick film resistors were determined as a function of glass composition at seven firing temperatures. These results indicate a retardation of microstructure development in the resistors as the amount of dissolved substrate increases. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Aug 31, 1978
- Accession Number
- ADA061051
Entities
People
- R. W. Vest
Organizations
- Purdue University