The Effects of Substrate Composition on Thick Film Circuit Reliability.

Abstract

The viscosity of the resistor glass was measured as a function of dissolved AlSiMag 614 substrate from the softening point to the annealing point of the glasses. The isothermal viscosity was found to increase by a factor of 20 for glass with 10w/o dissolved substrate relative to the standard lead borosilicate glass. The sheet resistances and hot and cold TCRs of thick film resistors were determined as a function of glass composition at seven firing temperatures. These results indicate a retardation of microstructure development in the resistors as the amount of dissolved substrate increases. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Aug 31, 1978
Accession Number
ADA061051

Entities

People

  • R. W. Vest

Organizations

  • Purdue University

Tags

DTIC Thesaurus Topics

  • Chemistry
  • Electrical Measurement
  • Electrical Properties
  • Film Resistors
  • Films
  • Glass Resistors
  • Materials
  • Materials Engineering
  • Measurement
  • Optical Materials
  • Particle Size
  • Physical Properties
  • Resistance
  • Resistors
  • Softening Point
  • Thick Films
  • Viscosity

Readers

  • Materials Science and Engineering.
  • Surface Coatings Technology.
  • Surface Engineering/Surface Coating Technology.