Silicon Nitride Layers on Gallium Arsenide by Low Energy Ion Beam Sputtering.

Abstract

Low energy ion beam sputtering with argon was used to deposit layers of Si3N4 onto GaAs for encapsulation purposes. Mechanical stability to above 900 C has been achieved; silicon diffuses into the GaAs at 600 C and above; index of refraction is a simple, but reliable test of encapsulant quality. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Oct 01, 1978
Accession Number
ADA061652

Entities

People

  • J. R. Sites
  • L. E. Bradley

Organizations

  • Colorado State University

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Adhesion
  • Alcohols
  • Amplifiers
  • Ceramic Materials
  • Contracts
  • Encapsulation
  • Films
  • Gallium Arsenides
  • Ion Beams
  • Ions
  • Military Research
  • Partial Pressure
  • Refraction
  • Refractive Index
  • Sputtering
  • Surface Properties
  • United States

Fields of Study

  • Physics

Readers

  • Optical Physics and Photonics.
  • Solar Photovoltaics and Thermoelectric Devices.
  • Surface Engineering/Surface Coating Technology.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene