An Investigation of Switching Behaviors of Bimetallic-Disk Thermostats

Abstract

Thermostatic switches that use a bimetallic, curved disk as the control element have been known to exhibit, on occasion, anomalous switching behaviors, such as a gradual drift of or sudden deviation from the original switching temperatures. A detailed analysis is presented in this report to show that a class of these switching anomalies can be attributed to an improperly designed interaction between the disk and the elastic switching armature. The analysis is based on Wittrick's theory of thermoelastic stability of the bimetallic disk, extended to include the effects of a central force. The resulting nonlinear problem was solved numerically on a digital computer with the aid of an existing solution routine for two-point boundary-value problems. Numerical results indicate that under certain combinations of geometrical, mechanical and thermal conditions, the thermostat may fail to respond to temperature changes with positive snap actions of the disk, thus resulting in the so-called temperature creepage or dithering phenomenon. Such events are usually characterized by a series of openings and closings of the contacts with reduced travel but greatly increased frequency, which can induce excessive arcing or fatigue damage that would cause the thermostat to malfunction.

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Document Details

Document Type
Technical Report
Publication Date
Jun 30, 1978
Accession Number
ADA061866

Entities

People

  • W. C. Hu

Organizations

  • The Aerospace Corporation

Tags

Communities of Interest

  • Energy and Power Technologies
  • Space
  • Weapons Technologies

DTIC Thesaurus Topics

  • Boundary Value Problems
  • Climate Change
  • Computer Programs
  • Computers
  • Corporations
  • Differential Equations
  • Equations
  • Geometry
  • Manufacturing
  • Materials
  • Numerical Analysis
  • Reliability
  • Residual Stress
  • Shape
  • Space Systems
  • Tensile Stress
  • Two Dimensional

Readers

  • Applied Combinatorial Optimization and Logic Circuit Design.
  • Fluid Dynamics.
  • Thermal Physics or Thermal Science.