Thermal Cycling Analysis of the Thermoplastic Modulator.
Abstract
The problem of heat removal from the faceplate of a Thermoplastic Modulator for Coherent Optical Processing during rapid write-erase cycling was analyzed using two complementary theoretical approaches. Pertinent cases were treated and important results, having bearing on future designs, were obtained. Also, three likely candidates for substrate-to-ambient cooling were compared with the result that only one seems feasible. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Jul 01, 1978
- Accession Number
- ADA062133
Entities
People
- David L. Flannery
Organizations
- Air Force Research Laboratory