Microstructural Changes Following Deformation of Ti-6Al-4V.

Abstract

Creep tests have been performed in the range 800-900 C on thin specimens of commercially pure titanium. It was observed that, in the temperature range of interest, the mode of failure was strongly dependent upon the imposed creep rate. Transmission electron microscopy revealed that recrystallization occurred during high creep rate deformation and that the recrystallization nuclei often occurred at grain boundary triple points where the dislocation density was relatively high. By contrast in low creep rate experiments there was no evidence of large scale recrystallization or grain boundary migration but dislocation climb appeared to be an important factor in creep in this region. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Oct 25, 1978
Accession Number
ADA063085

Entities

People

  • Abraham Rosen

Organizations

  • Technion – Israel Institute of Technology

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Boundaries
  • Creep
  • Creep Tests
  • Dislocations
  • Electron Microscopy
  • Elongation
  • Engineering
  • Grain Boundaries
  • Materials
  • Materials Engineering
  • Microscopy
  • Phase Transformations
  • Recrystallization
  • Strain Hardening
  • Titanium
  • Titanium Alloys
  • Transmission Electron Microscopy

Fields of Study

  • Materials science

Readers

  • Materials Science and Engineering.
  • Powder metallurgy of Titanium alloys.

Technology Areas

  • Microelectronics