The Effects of Substrate Composition on Thick Film Circuit Reliability.

Abstract

The sheet resistance, temperature dependence of the resistance, and the current noise were measured for thick film resistors as a function of the amount of alumina substrate dissolved in the resistor glass for resistor firing times from 4 to 22 minutes at 800 C. Large variations in these three properties were observed, and the changes were qualitatively correlated with changes in viscosity of the glass. The microstructure development and charge transport model used to correlate the results involves changing proportions of sintered and non-sintered contacts in the RuO2 networks within the body of the resistors. The solubility of RuO2 in the resistor glass was determined as a function of temperature and amount of substrate dissolved in the glass, and the kinetics of substrate dissolution were measured under varying processing conditions. Preliminary results on MIM devices fabricated with resistor glasses are presented. (Author)

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Nov 30, 1978
Accession Number
ADA063782

Entities

People

  • R. W. Vest

Organizations

  • Purdue University

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Capacitance
  • Crystal Structure
  • Dielectric Permittivity
  • Dielectric Properties
  • Dissipation Factor
  • Electrical Properties
  • Film Resistors
  • Films
  • Frequency
  • Glass Resistors
  • Materials
  • Metals
  • Physical Properties
  • Resistance
  • Resistors
  • Test Methods
  • Thick Films

Readers

  • Analytical Chemistry
  • Materials Science and Engineering.
  • Software Engineering