Effect of Heat Ageing and Related Phenomenon on the Black Oxide - Epoxy Bond,

Abstract

Peel testing was selected for evaluating the performance of the epoxy-black oxide bond under test conditions. This type of test was well suited because it was quantitative, repeatable and the test specimens could be laminated into flat pieces, resembling an MLB. It was established that the bond between epoxy prepreg and properly applied black oxide coating on copper foil is more heat resistant and stronger than the bond to the untreated foil. Thermal testing degrades the black oxide bond appreciably, but to a level no lower than the untreated foil. Black oxide, when properly applied, is suitable for use on any epoxy MLB provided it can be justified economically. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Feb 01, 1977
Accession Number
ADA064707

Entities

People

  • H. V. Connelly
  • J. Marro
  • W. S. Deforest

Tags

DTIC Thesaurus Topics

  • Adhesion
  • Circuit Boards
  • Cycles
  • Ground Support
  • Ground Support Equipment
  • Heat Capacity
  • High Reliability
  • Hydrochloric Acid
  • Laminates
  • Life Cycles
  • Manufacturing
  • Materials
  • Oxide Films
  • Oxides
  • Resistance
  • Thermal Cycling Tests
  • Thermal Resistance

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