Evidence for 'Inclined' CO on Pd(210).

Abstract

The ESDIAD method (Electon Stimulated Desorption Ion Angular Distributions) has been used to verify an unusual bonding configuration for CO adsorbed on the rather open Pd(210) surface. In a previous infrared reflection-adsorption study of CO on Pd(210) (where top layer atoms with the nearest neighbor distance of 2.73 A do not exist) the results indicated that CO was bridge-bonded to two Pd atoms via the carbon atom. Such bridge-bonding can only occur in several distinct sites between atoms in the first and second atom layers, so that the axes of absorbed CO molecules are expected to be inclined away from the normal by approx. 18 deg. The ESDIAD data are consistent with the infrared observations at low coverages (two-fold symmetric triangular ESDIAD patterns dominated by off-normal ion emission in appropriate symmetry directions), but the results are more complex at higher coverages. At the saturation CO coverage at 90 K, the data indicate that CO is bonded normal to the surface. The relative yields of O(+) and CO(+) ions are sensitive to the bonding mode, with O(+) alone seen for bridge-bonded CO at low coverages and both O+ and CO(+) ions observed at higher coverages. (Author)

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Document Details

Document Type
Technical Report
Publication Date
May 01, 1979
Accession Number
ADA068192

Entities

People

  • A. M. Bradshaw
  • F. M. Hoffmann
  • John Yates
  • Theodore E. Madey

Organizations

  • National Institute of Standards and Technology

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Adsorption
  • Carbon Monoxide
  • Carbonyl Complexes
  • Chemistry
  • Desorption
  • Dielectric Gases
  • Electron Diffraction
  • Electron Energy
  • Electrons
  • Energy
  • Frequency
  • Magnetic Resonance
  • Measurement
  • Metals
  • Nuclear Magnetic Resonance
  • Spectra
  • Transition Metals

Readers

  • Electrochemical Engineering/ Fuel Cell Technologies
  • Electromagnetic Wave Scattering and Antenna Radiation Engineering
  • Materials Science and Engineering.