Compressive Strength and Indentation Damage in Ceramic Materials.

Abstract

The threshold loads and crack sizes for indentation cracking were investigated for a number of ceramics using scanning electron microscopy and acoustic emission. It was found that the cracking behavior could be predicted, using a fracture mechanics/dimensional analysis approach modified to take into account the stress field at an elastic-plastic indentation. Selected area electron channeling was used to characterize the extent of subsurface damage produced in ceramics during grinding and polishing operations. It was found that polishing damage depths can be correlated using a simple model based on a sliding elastic-plastic indenter. Finally, the effect of temperature and strain rate upon material removal and cracking threshold was analyzed, using recent experimental compressive strength and crack growth measurements as inputs to current predictive models. The results are shown to have surprising implications with regard to dynamic, high temperature indentation (particle impact). (Author)

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Document Details

Document Type
Technical Report
Publication Date
Jun 01, 1979
Accession Number
ADA070256

Entities

People

  • David L. Davidson
  • James Lankford Jr.

Organizations

  • Southwest Research Institute

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms

DTIC Thesaurus Topics

  • Acoustic Emissions
  • Aluminum Oxides
  • Ceramic Materials
  • Compressive Strength
  • Cracks
  • Damage
  • Drug Abuse
  • Electron Microscopy
  • Fracture (Mechanics)
  • High Temperature
  • Materials
  • Measurement
  • Mechanical Properties
  • Mechanics
  • Scanning Electron Microscopy
  • Silicon Carbide
  • Tensile Strength

Fields of Study

  • Materials science

Readers

  • Materials Science (Mechanical Engineering).

Technology Areas

  • Microelectronics