Non-Noble Colloidal Catalysts.
Abstract
This investigation is concerned with the development of non-noble metal autocatalytic colloids suitable for initiating electroless copper plating of printed wiring boards (PWB's). Additionally, the processing materials and parameters are selected and adjusted so that costs are reduced and the reliability of the PWB's are increased. This is achieved by the elimination of 'precious metals' as catalysts and the maintenance of near-normal pH levels (approx. 5-10) throughout the process thereby minimizing acidic residues on the PWB 's. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- May 01, 1979
- Accession Number
- ADA072757
Entities
People
- Nathan Feldstein