Engineering Design Handbook. Dielectric Embedding of Electrical or Electronic Components

Abstract

Contents: Purpose of Dielectric Embedding--Methods of Embedding- Casting, Potting, Impregnation, Encapsulation, Transfer Molding, Coatings (Conformal and Surface Types), Considerations for Choice of Processes, Molds, Etc.; General Inforamtion on Embedding Resins and Procedures for Use; Epoxy Embedding Agents; Polyurethane Embedding Agents; Silicone Embedding Agents; Vapor-Deposited Poly-p-Xylylene Dielectrics; Use of Fillers; Embedments and Electrical Properties; Factors of Resin Purity and Component Cleaning; Protection Against Moisture, Corrosion, and Biological Degradation; Coatings for Circuit Boards and Similar Substrates; Stress; Resin Type Choice; Correction of Defective Embedments; Appendixes; changes in the Technology Up-To-Date Advice on Embedding.

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Document Details

Document Type
Technical Report
Publication Date
Apr 06, 1979
Accession Number
ADA074139

Tags

Communities of Interest

  • Advanced Electronics
  • Biomedical
  • Ground and Sea Platforms
  • Space
  • Weapons Technologies

DTIC Thesaurus Topics

  • Biomedical And Dental Materials
  • Chemical Synthesis
  • Chemistry
  • Material Degradation Processes
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Materials Testing
  • Organic Chemistry
  • Polymer Chemistry
  • Polymeric Films

Fields of Study

  • Materials science

Readers

  • Computational Linguistics
  • Reinforced Composite Materials
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene