Effect of Workpiece Properties on Grinding Forces in Polycrystalline Ceramics.

Abstract

Grinding forces have been measured on a number of polycrystalline ceramics and correlations between the forces and workpiece properties have been attempted in an effort to gain insight into mechanisms of chip formation. The closest correlations were with a parameter related to the indentation fracture characteristics of each workpiece. This suggest that a major mechanism of chip formation during multipoint abrasive machining of ceramics is fracture resulting from the plastic indentation of the workpiece by the abrasive grains. Grinding forces during up and down grinding were different but both correlated with the indentation fracture parameter when the comminution characteristics of the chips during down grinding were accounted for. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Jun 01, 1979
Accession Number
ADA075388

Entities

People

  • B. G. Koepke
  • R. J. Stokes

Organizations

  • Honeywell International, Inc.

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies
  • Sensors
  • Weapons Technologies

DTIC Thesaurus Topics

  • Aluminum Oxides
  • Ceramic Materials
  • Crystal Structure
  • Diamond Wheels
  • Engineering
  • Ferrites
  • Grain Size
  • Materials
  • Materials Laboratories
  • Materials Science
  • Mechanical Properties
  • Mechanics
  • Military Research
  • Physics Laboratories
  • Plastic Flow
  • Surface Properties
  • Tensile Strength

Fields of Study

  • Materials science

Readers

  • Manufacturing Engineering.
  • Materials Science and Engineering.
  • Theoretical Analysis.