Semi-Additive Processes for Fabrication of Printed Wiring Boards.

Abstract

Printed wiring boards fabricated by semi-additive processes from four laminate types have met the requirements of MIL-P-13949, MIL-P-5110, and selected tests of MIL-P-55640. Laminate types consisted of ultra-thin copper with peelable carrier, ultra-thin copper with etchable carrier, sacrificial foil, and adhesively-coated nonclad. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Jun 01, 1979
Accession Number
ADA075975

Entities

People

  • Jack Quintana

Organizations

  • Hughes Aircraft Company

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms
  • Ground and Sea Platforms
  • Weapons Technologies

DTIC Thesaurus Topics

  • Celestial Navigation
  • Chemical Synthesis
  • Chemistry
  • Circuit Boards
  • Control Systems
  • Fabrication
  • Films
  • High Density
  • Laminated Glass
  • Manufacturing
  • Materials
  • Materials Testing
  • Printed Circuit Boards
  • Printed Circuits
  • Production
  • Test And Evaluation
  • Test Methods

Fields of Study

  • Materials science

Readers

  • Electrical Engineering
  • Nanofabrication and Microfabrication.