Equipment for Testing the Creep Properties of Metals under Intermittent Stressing and Heating Conditions. Part 1

Abstract

Very little is known about the separate or combined effects of intermittent heating and stressing on the elevated temperature creep and creep- rupture characteristics of aircraft structural metals. Such information is important since aircraft and engines will be subject to these conditions. Between flights, loads and temperatures are low; during flights, they are high. Exact service conditions cannot be reproduced in the laboratory, but arbitrary cycles have been chosen for initial work. In view of the need for more complete information on the effects of such intermittent heating and stressing on the creep and creep-rupture properties of structural sheet materials, an experimental program on this subject was initiated. (Possible theoretical analyses of the results will be made later.) One of the major problems of the program was the development of suitable equipment for the investigation. A description of four creep testing machines, specially designed for this program, with automatic electronic control units is given herein. This equipment is designed to produce any combination, separately or simultaneously, of intermittent heating and stressing of creep-rupture sepcimens, in or out of phase.

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Document Details

Document Type
Technical Report
Publication Date
Jul 01, 1952
Accession Number
ADA076056

Entities

People

  • John E. Dorn
  • Lawrence A. Shepard

Organizations

  • University of California, Berkeley

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Air Force
  • Creep
  • Government Procurement
  • Governments
  • High Temperature
  • Machines
  • Materials
  • Materials Laboratories
  • Measurement
  • Metals
  • Photographs
  • Recording Systems
  • Solenoid Valves
  • Strain Gages
  • Tensile Strength
  • United States
  • Valves

Readers

  • Aerospace Test and Evaluation
  • Mechanical Engineering/Mechanics of Materials.
  • Theoretical Analysis.

Technology Areas

  • Microelectronics