Standard Engineering Installation Package, Technical Control Facility, Technical Control Improvement Program (TCIP)

Abstract

This standard engineering installation package (SEIP) is prepared for projects which require overall standardization by communications-electronics commands in various parts of the world. It is used for guidance in preparing an engineering installation package (EIP) for a specific site, tailored to its unique requirements. This SEIP provides the guidance involved in selecting, acquiring, and installing equipment to update and improve technical control facilities worldwide. It contains engineering analysis, site preparation information, and discusses the communications engineering plan. Equipment requirements for narrowband and wideband systems are discussed and detail engineering is extensively covered. The SEIP contains a list of applicable documents, suggests a checklist for site surveys, tells how to install and cutover equipment, reproduces typical engineering drawings, and gives a sample bill of materials. The SEIP also describes quality assurance plan, acceptance test plan and procedures, and the completion certification.

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Document Details

Document Type
Technical Report
Publication Date
Oct 01, 1979
Accession Number
ADA078223

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies
  • Space

DTIC Thesaurus Topics

  • Acceptance Tests
  • Accuracy
  • Circuit Boards
  • Communication Systems
  • Detection
  • Ducts
  • Engineers
  • Measurement
  • Power Supplies
  • Printed Circuits
  • Processing Equipment
  • Scheduling (Production)
  • Standards
  • Test And Evaluation
  • Test Equipment
  • Test Facilities
  • Wiring Diagrams

Fields of Study

  • Engineering

Readers

  • Software Engineering

Technology Areas

  • Microelectronics