The Effects of Substrate Composition on Thick Film Circuit Reliability.

Abstract

Measurements of the density of, and the ripening of RuO2 in, thick film glasses as a function of temperature and amount of ALSiMag 614 (96% AL2O3) substrate dissolved in the glasses were conducted. The minor constituents (4%) in the substrate were found to have an anomalously large effect on the density. The ripening results were interpreted in terms of a phase boundary reaction rate limiting step, and the transfer coefficient was calculated from the data. A theoretical equation was derived for the initial stage sintering kinetics of RuO2 in the glass. This equation was combined with the results of the ripening study to predict the neck growth between RuO2 particles as a function of temperature and amount of dissolved substrate. (Author)

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Nov 30, 1979
Accession Number
ADA080095

Entities

People

  • R. W. Vest

Organizations

  • Purdue University

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Coefficients
  • Diffusion Coefficient
  • Electrical Properties
  • Energy
  • Equations
  • Film Resistors
  • Films
  • Glass
  • Mass Transfer
  • Materials
  • Materials Engineering
  • Particle Size
  • Particles
  • Physical Properties
  • Surface Tension
  • Thick Films
  • Viscosity

Readers

  • Polymer Science and Technology
  • Spectroscopy.
  • Thin Film Deposition Science.