Methods for Manufacturing Heat Pipes for Circuit Cards.

Abstract

Manufacturing processes to fabricate heat pipes for circuit cards were evaluated. These included shell and wick fabrication, shell and wick joining, and vacuum/fill and testing. Cost effective processes were selected to meet production requirements. A production facility was designed based on cost trade-offs. The results of the evaluation, selection of recommended manufacturing methods and the design of the production facility are presented. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Mar 01, 1979
Accession Number
ADA080188

Entities

People

  • Kal S. Sekhon
  • Lloyd A. Nelson

Organizations

  • Hughes Aircraft Company

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms
  • Energy and Power Technologies
  • Human Systems

DTIC Thesaurus Topics

  • Assembly
  • Chemistry
  • Circuit Boards
  • Electronic Components
  • Fabrication
  • Heat Energy
  • Heat Pipes
  • Heat Transfer
  • Joints
  • Manufacturing
  • Mass Production
  • Performance Tests
  • Pipes
  • Printed Circuits
  • Temperature Gradients
  • Test And Evaluation
  • Thermal Conductivity

Readers

  • Software Engineering
  • Thermal Physics or Thermal Science.