Surface Contamination of Adhesive Bonding Materials.

Abstract

The surface composition of adherend materials, as received, is usually entirely different from the bulk and generally unsuitable for adhesive bonding. Consequently, prebonding treatments of adherend surfaces are usually necessary to remove unwanted chemical species and to modify the surface chemistry and topography in order to produce a strong and durable bond. Auger electron spectroscopy, ion scattering spectroscopy, and secondary ion mass spectroscopy were used to characterize adhesive bonding materials as received and at various prebonding stages. The presence of contaminants or undesirable materials has been traced to manufacturing processes, prebonding treatments, and environment. In many instances the presence of contaminants or unwanted materials has been directly related to poor bond performance. (Author)

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Dec 01, 1979
Accession Number
ADA081316

Entities

People

  • J. S. Solomon
  • W. L. Baun

Organizations

  • University of Dayton

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Auger Electrons
  • Chemical Synthesis
  • Chemistry
  • Composite Materials
  • Mass Spectra
  • Mass Spectrometry
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Mechanical Properties
  • Mechanics
  • Spectra
  • Spectrometry
  • Spectroscopy
  • Surface Chemistry
  • Water Vapor

Fields of Study

  • Materials science

Readers

  • Groundwater Contamination Remediation.
  • Plasma Physics.
  • Reinforced Composite Materials

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene