Phase II Final Development Report for High-Reliability, Low-Cost Integrated Circuits.

Abstract

The objectives of Phase II of this investigation were to fabricate significant quantities of eight integrated circuit types using the techniques defined in Phase I (see Phase I Final Development Report for High Reliability, Low Cost Integrated Circuits), perform a preliminary reliability investigation, and formulate comparative cost data. Wafers and finished devices were processed for eight integrated-circuit types. These types included three TTL circuits (5420, 5472, 5470), one Schottky TTL circuit (54S20), three CMOS circuits (CD4012B, CD4014A, CD4027A) and one linear circuit (CA741). The preliminary reliability investigations defined potential reliability problems, which were subsequently successfully resolved, and provided preliminary data regarding activation energies and failure rates. The comparative cost analysis indicated that the cost goal of the contract can be met.

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Document Details

Document Type
Technical Report
Publication Date
May 22, 1979
Accession Number
ADA081666

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Assembly
  • Ceramic Materials
  • Data Analysis
  • Fabrication
  • Failure Mode And Effect Analysis
  • High Reliability
  • Integrated Circuits
  • Life Tests
  • Materials
  • Metals
  • Moldings
  • Plastic Explosives
  • Reliability
  • Semiconductor Devices
  • Semiconductors
  • Test And Evaluation
  • Two Dimensional

Fields of Study

  • Engineering

Readers

  • Integrated Circuit Design and Technology.
  • Systems Analysis and Design