Diamond Technology Study.

Abstract

A comprehensive study has been conducted into the use of diamond as a TWT helix support material to increase the average output power capability of broadband high frequency helix TWT's. A survey of the progress from the inception of diamond supported helix work in 1971, at Raytheon, to the present is presented. Methods for constructing diamond supported helices using compression, brazed, and diffusion bonded interfaces are described. The construction and test of experimental helix assemblies of all three types are described, and it is shown that a compression supported helix is most practical to design and build. Test results on compression-type copper plated tungsten helix assemblies are presented showing power dissipations of 1800 watts per inch for solenoid focused I-band helices and 500 watts per inch for PPM focused K-band helices. The emphasis was on development of practical engineering design technology. A simple analysis procedure is described using thermal resistance methods for accurately calculating the temperature rise of a TWT helix for a given power dissipation. Correlation of calculated values with experimental results was good. This shows that the analysis method is accurate, and that the construction techniques used achieved the theoretical capability of the diamond supported helix. Detailed descriptions of the experimental results and methods are presented.

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Document Details

Document Type
Technical Report
Publication Date
Jun 11, 1979
Accession Number
ADA081928

Entities

Organizations

  • RTX

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Bandwidth
  • Ceramic Materials
  • Conduction (Heat Transfer)
  • Conductivity
  • Construction
  • Crystal Lattices
  • Dielectric Properties
  • Dielectrics
  • Frequency
  • Frequency Bands
  • Heat Transfer
  • K Band
  • Microwave Frequency
  • Microwave Tubes
  • Physical Properties
  • Thermal Conductivity
  • Thermal Resistance

Fields of Study

  • Physics

Readers

  • Electronics Engineering
  • Systems Analysis and Design
  • Thin Film Deposition Science.